Dual-interface ic card components and method for manufacturing the dual-interface ic card components

ABSTRACT

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. Other embodiments are also described.

This application is a continuation-in-part application of U.S. patent application Ser. No. 14/242,031, filed on Apr. 1, 2014, which is incorporated herein by reference.

Embodiments of the invention relate generally to electronic circuits and, more particularly, to integrated circuit (IC) devices and methods for manufacturing IC devices.

An IC card, such as a smart card, includes an embedded integrated circuit that can be used to store information and perform data processing. For example, a portable IC card can be used in financial, transportation, security, healthcare, or other applications to provide identification and authentication. Types of IC cards include contact IC cards that communicate via electrical contacts, contactless IC cards that communicate wirelessly through antennas, and dual-interface IC cards that communicate via electrical contacts and wirelessly through antennas. Compared to contact IC cards and contactless IC cards, dual-interface IC cards allow users to switch between contact card readers and contactless card readers. However, since dual-interface IC cards include both electrical contacts and antennas, the dual-interface IC cards are more expensive to manufacture than contact IC cards and contactless IC cards. In addition, a dual-interface IC card is generally required to fulfill mechanical requirements to ensure that the dual-interface IC card can continue to operate properly under mechanical stress. For example, the chip card module of a dual-interface IC card needs to continue to be attached to the card body when a mechanical load is applied to the card body. In addition, the chip card module of a dual-interface IC card needs to deform together with the card body and stay functional after certain mechanical deformation. The chip card module needs to protect the integrated circuit and wire connections inside the chip card module of a dual-interface IC card from being damaged by mechanical deformation. Therefore, there is a need for low-cost and flexible dual-interface IC card components and manufacturing flexible dual-interface IC card components in a cost-effective manner.

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. The dual-interface contact structure is more cost-effective than using a prefabricated dual-interface contact tape currently available in the marketplace, which is typically made from scratch using etching or stamping technology. In addition, the dual-interface contact structure is more cost-effective than a dual-interface contact structure manufactured by applying an adhesive material to completely cover an overlapping area of an antenna contact and a substrate. Other embodiments are also described.

In an embodiment, a method for manufacturing a dual-interface IC card component involves obtaining a single-sided contact base structure, where the single-sided contact base structure includes a substrate with an electrical contact layer and attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card.

In an embodiment, a method for manufacturing a dual-interface IC card component involves obtaining a base structure, where the base structure includes a substrate, attaching at least one antenna contact lead to the base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card and plating the at least one antenna contact and the base structure with at least one metal material.

In an embodiment, a dual-interface IC card component includes a substrate, an electrical contact layer attached to a first side of the substrate and at least one antenna contact lead glued to a second, opposite, side of the substrate in an area that is smaller than the overlapping area of the at least one antenna contact and the substrate. The electrical contact layer includes a contact plate and a plurality of grooves.

Other aspects and advantages of embodiments of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, depicted by way of example of the principles of the invention.

FIG. 1 is a cross-sectional view of a dual-interface IC card in accordance with an embodiment of the invention.

FIG. 2 depicts a front-side view of an embodiment of a dual-interface IC chip module of the dual-interface IC card depicted in FIG. 1.

FIG. 3 depicts a back-side view of the dual-interface IC chip module depicted in FIG. 2.

FIG. 4 depicts an embodiment of a single-sided contact tape, which is used to produce a dual-interface contact base structure for the dual-interface IC chip module depicted in FIG. 2.

FIG. 5 is a cross-sectional view of a single-sided contact tape depicted in FIG. 4.

FIG. 6 depicts an embodiment of a single-sided contact tape with adhesive material applied to the tape.

FIG. 7 is a cross-sectional view of the single-sided contact tape depicted in FIG. 6.

FIG. 8 depicts an embodiment of a dual-interface contact structure having an antenna contact lead.

FIG. 9 is a cross-sectional view of the dual-interface contact structure depicted in FIG. 8.

FIG. 10 depicts an embodiment of a reel of dual-interface IC chip modules produced using the dual-interface contact structure depicted in FIGS. 8 and 9.

FIG. 11 is a cross-sectional view of a single dual-interface IC chip module depicted in FIG. 10.

FIG. 12 illustrates some mechanical tests for the dual-interface IC card depicted in FIG. 1.

FIG. 13 illustrates a deformation of the dual-interface IC card depicted in FIG. 1 under mechanical tests.

FIG. 14 is a process flow diagram of a method for manufacturing a dual-interface IC card component in accordance with an embodiment of the invention.

FIG. 15 is a process flow diagram of a method for manufacturing a dual-interface IC card component in accordance with another embodiment of the invention.

Throughout the description, similar reference numbers may be used to identify similar elements.

It will be readily understood that the components of the embodiments as generally described herein and illustrated in the appended figures could be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of various embodiments, as represented in the figures, is not intended to limit the scope of the present disclosure, but is merely representative of various embodiments. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the invention is, therefore, indicated by the appended claims rather than by this detailed description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Reference throughout this specification to features, advantages, or similar language does not imply that all of the features and advantages that may be realized with the present invention should be or are in any single embodiment. Rather, language referring to the features and advantages is understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment. Thus, discussions of the features and advantages, and similar language, throughout this specification may, but do not necessarily, refer to the same embodiment.

Furthermore, the described features, advantages, and characteristics of the invention may be combined in any suitable manner in one or more embodiments. One skilled in the relevant art will recognize, in light of the description herein, that the invention can be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the invention.

Reference throughout this specification to “one embodiment,” “an embodiment,” or similar language means that a particular feature, structure, or characteristic described in connection with the indicated embodiment is included in at least one embodiment. Thus, the phrases “in one embodiment,” “in an embodiment,” and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment.

FIG. 1 is a cross-sectional view of a dual-interface IC card 100 in accordance with an embodiment of the invention. The dual-interface IC card can be used in financial, transportation, security, healthcare, or other applications to store information and perform data processing. In some embodiments, the dual-interface IC card has the ability to securely manage, store and provide access to data on the card, perform on-card functions, such as encryption, authentication, and authorization, and interact intelligently with a card reader. The dual-interface IC card can communicate by electrical contacts or wirelessly through an antenna. In an embodiment, the dual-interface IC card is a smart card, which can be used in Near field communication (NFC) applications. In some embodiments, the IC card is a smart card that is designed to be compatible with the International Organization for Standardization (ISO)/the International Electrotechnical Commission (IEC) 14443. As described in more detail below, the manufacturing cost of the dual-interface IC card can be significantly lower than conventional dual-interface IC cards because the dual-interface IC card can be produced using a prefabricated single-sided contact base structure that is used to make a module for a contact smart card (e.g., a standard single-sided contact tape currently available in the marketplace), rather than a more expensive prefabricated double-sided contact base structure that is used to make a module for a dual-interface smart card (e.g., a standard double-sided contact tape currently available in the market). In addition, the manufacturing cost of the dual-interface IC card can be significantly lower than

In the embodiment depicted in FIG. 1, the dual-interface IC card 100 includes a contact layer 102, a substrate 104, an adhesive layer 106, antenna contact leads 108, an IC chip 110, bond wires 112, an encapsulation 114, adhesives 116, an electrical connection layer 118, an antenna layer 120, and a card body 122. Although the dual-interface IC card is shown in FIG. 1 as including certain components, in other embodiments, the dual-interface IC card may include fewer components or additional components that are commonly found in conventional dual-interface smart cards.

The contact layer 102 of the dual-interface IC card 100 is used to make electrical contacts with a card reader to communicate with the card reader. In some embodiments, the contact layer is located at the front side of the dual-interface IC card while the card body 122 is located at the back side of the dual-interface IC card. The contact layer may be made of metal or other conductive material. In some embodiments, the contact layer is made of Gold (Au)-Nickel (Ni) plated Copper (Cu) foil or galvano deposited Cu. The contact layer, which is also referred to as the contact pad, provides electrical connectivity when the dual-interface IC card is inserted into a card reader. In some embodiments, the contact layer is designed and produced to be compatible with the International Organization for Standardization (ISO) 7816. The contact layer typically includes groove/recess lines used to electrically insulate contact areas of the contact layer from each other and make the contact layer more flexible. In the embodiment depicted in FIG. 1, the contact layer has two groove lines 124-1, 124-2. However, in other embodiments, the contact layer may have any number of groove lines.

The substrate 104 is used to support other elements of the dual-interface IC card 100, such as the contact layer 102, the antenna contact leads 108 and the IC chip 110. The substrate may be made of any suitable substrate material. As an example, the substrate may be made of Epoxy glass, fiberglass, or plastic substrates (Polyethylene naphthalate (PEN), etc.). In the embodiment depicted in FIG. 1, a bonding hole 126 is present on the substrate to enable wire bonding of the IC chip 100 to the contact layer. The substrate may be in the form of a sheet or a tape. In some embodiments, the contact layer and the substrate form a single-sided contact base structure, which may be packaged into a single-sided contact tape. For example, a device manufacturer may produce a prefabricated single-sided contact base structure that includes the contact layer and the substrate in mass quantities. In some embodiments, an optional adhesive layer 103 is located between the contact layer and the substrate.

The adhesive layer 106 of the dual-interface IC card 100 is used to attach the antenna contact leads 108 onto the substrate 104. The adhesive layer 106 may be made of any suitable adhesive material or a combination of adhesive materials. Examples of the adhesive material that can be used for the adhesive layer include (without being limited to) conductive glue (e.g., anisotropic conductive glue), non-conductive glue (e.g., hotmelt), double sided sticky tapes, and anisotropic conductive foils. In some embodiments, the adhesive layer 106 is made of glue. The adhesive layer can be formed by applying an adhesive material (e.g., glue) on the substrate and/or the antenna contact leads by various processes. For example, the adhesive material may be dispense on the substrate or pre-applied on the antenna contact leads. A curing process (e.g., oven curing) may then be performed to cure the adhesive material. In some embodiments, the antenna contact leads are plated after the adhesive material is cured with one or more plating materials, such as nickel (Ni), gold (Au) and palladium (Pd). Plating the antenna contact leads can allow the antenna contact leads to have better electrical conductivity.

The antenna contact leads 108 of the dual-interface IC card 100 are used to provide electrical contacts between an antenna (e.g., the antenna layer 120) and the IC chip 110. The antenna contact leads may be made of any suitable conductive material. For example, the antenna contact leads may be made of a metal foil or a metal laminate, which includes a metal foil and a substrate. In some embodiments, the antenna contact leads are made of gold and nickel (Au—Ni) plated copper (Cu) or silver (Ag) plated stainless steel. The antenna contact leads may be made in any suitable dimensions. In some embodiments, the antenna contact leads have a uniform thickness. For example, the thickness of the antenna contact leads may be in a range (e.g., between 10 micrometers (μm) and 100 μm), which overlaps with the standard thickness for antenna contact leads (e.g., between 18 μm and 35 μm for Cu foil) of smart cards. The antenna contact leads can be produced by any suitable process, including (without being limited to), punching, etching and laser cutting a sheet or a reel to reel of a conductive material or a sheet or a reel to reel of a non-conductive material with a conductive plating. In some embodiments, the antenna contact leads are produced by punching either a standalone conductive sheet or a conductive sheet in a reel-to-reel format. In some embodiments, the antenna contact leads are produced by depositing a metal layer on a plastic substrate material. In some embodiments, the antenna contact leads are plated with suitable material, such as Ni, Au and/or Ag, for better antenna attachment or for better wire bond attachment. The antenna contact leads may be made of any suitable shape or dimension. In some embodiments, the antenna contact leads are designed and produced with features to ease the interconnection process with the substrate 104. For example, one or more antenna contact leads may have a spring like feature or may be crimped to improve adhesion of the conductive material (e.g., glue etc.) used in the interconnection process. The antenna contact leads can be attached to the substrate 104 by a pick-and-place process in which one or more antenna contact leads are picked up and placed on the substrate. Alternatively, the antenna contact leads can be attached to the substrate in a reel-to-reel process in which adhesive is applied to the antenna contact leads on a first reel, which is then applied onto a second reel, i.e., the single-sided contact tape, similar to the process of attaching a sheet of paper labels onto products. In some embodiments, instead of contact leads, a primary antenna structure is applied to the substrate 104 by a pick-and-place process in which the primary antenna structure is picked up and placed on the substrate. Although the antenna contact leads are shown in FIG. 1 as being electrically connected to the antenna layer 120 through the electrical connection layer 118, in other embodiments, the antenna contact leads may be in direct contact with the antenna layer. In addition, in other embodiments, the antenna contact leads are either connected to an antenna located on the substrate 104 or connected to a small antenna directly placed on the substrate, to be compliant with ISO/IEC 14443 requirements. In these embodiments, the antenna layer 120 acts as a “booster” antenna, which is electromagnetically coupled to the antenna located on the substrate.

In some embodiments, the contact layer 102, the substrate 104, the adhesive layer 106, and the antenna contact leads 108 form a dual-interface contact structure, which may be produced in mass quantities. For example, a device manufacturer can produce dual-interface contact structures in mass quantities based on prefabricated single-sided contact base structures, such as prefabricated single-sided contact tapes provided by Linxens, Interplex, Kinsus, LG Innotek and Possehl.

The IC chip 110 of the dual-interface IC card 100 includes circuitry to securely manage, store and provide access to data on the card and/or perform on-card functions, such as encryption, authentication, and authorization. The IC chip is designed to communicate with another device (e.g., a card reader) by electrical contacts or wirelessly through an antenna. In the embodiment depicted in FIG. 1, the dual-interface IC card includes a single IC chip with both contact and contactless interfaces, which makes is possible to access the IC chip 110 using either a contact interface (e.g., the contact layer 102) or a contactless interface (e.g., the antenna layer 120) with a high level of security. Alternatively, the dual-interface IC card may include two IC chips, including one IC chip with a contact interface and another, separated, IC chip with a contactless interface. The IC chip may be attached to the substrate 104 using any appropriate method. As an example, in some embodiments, the IC chip is glued onto the substrate using an adhesive layer 107.

The bond wires 112-1, 112-2 of the dual-interface IC card 100 are used to electrically connect the IC chip 110 to the contact layer 102 and to the antenna layer 120. The bond wires may be made of any suitable metal (e.g., aluminum or copper). In the embodiment depicted in FIG. 1, the bond wire 112-1 electrically connects the IC chip to the contact layer while the bond wire 112-2 electrically connects the IC chip to the antenna contact leads 108, which is electrically connected to the antenna layer 120. Bond pads may be used to attach the bond wires to the IC chip, the antenna contact leads, and/or the contact layer. In other embodiments, the connections between the bond wires and the contact layer or antenna contact leads may be different from the connections shown in FIG. 1.

The encapsulation 114 of the dual-interface IC card 100 is used to protect the bond wires 112 and the IC chip 110. The encapsulation may be made of a suitable material, such as epoxy, in a process such as glob-top or molding.

In some embodiments, the contact layer 102, the substrate 104, the adhesive layer 106, the antenna contact leads 108, the IC chip 110, the bond wires 112, and the encapsulation 114 form a dual-interface IC chip module 150. A device manufacturer may produce dual-interface IC chip modules in mass quantities. For example, a device manufacturer may produce dual-interface IC chip modules in mass quantities based on dual-interface contact structures. Each dual-interface contact structure includes the contact layer, the substrate, the adhesive layer, and the antenna contact leads.

The adhesives 116 of the dual-interface IC card 100 are used to attach the dual-interface IC chip module 150, to the card body 122. The adhesives may be made of a suitable material, such as film material or gel material (e.g., epoxy or acrylate). In an embodiment, the adhesives are made of a hot melt adhesive material, such as adhesive epoxy or any other thermoplastic material, which becomes viscous with heat.

The electrical connection layer 118 of the dual-interface IC card 100 is used to provide electrical connectivity between the antenna contact leads 108 and the antenna layer 120. The electrical connection layer may be made of any suitable conductive material. For example, the electrical connection layer may be made of a conductive adhesive, a solder or a conductive polymeric material.

The antenna layer 120 of the dual-interface IC card 100 is used to communicate wirelessly with another device (e.g., a card reader). The antenna layer may be made of metal or other suitable material. In some embodiments, the antenna layer is made of a metal coil, such as a copper coil. The antenna layer may be of any suitable shape, including (without being limited to) circular, rectangular and square shapes.

The card body 122 of the dual-interface IC card 100 is used to protect other components of the dual-interface IC card and well as to give shape to the dual-interface IC card. The card body may be made of plastic or other suitable material. In some embodiments, an assembly step can be performed by attaching the antenna layer 120 and the card body to the dual-interface IC chip module 150 to produce the dual-interface IC card.

FIG. 2 depicts a front-side view of an embodiment of the dual-interface IC chip module 150 depicted in FIG. 1. In the embodiment depicted in FIG. 2, a front-side view of a dual-interface IC chip module 250 shows a contact layer 202, which includes a contact plate 232 and groove lines 224. The contact layer 202 depicted in FIG. 2 is one possible embodiment of the contact layer 102 depicted in FIG. 1. However, the contact layer 102 depicted in FIG. 1 is not limited to the embodiment shown in FIG. 2. For example, the contact layer 102 depicted in FIG. 1 may have groove/recess lines that are different from the groove lines 224 shown in FIG. 2.

FIG. 3 depicts a back-side view of the dual-interface IC chip module 250 depicted in FIG. 2. In the embodiment depicted in FIG. 3, a back-side view of the dual-interface IC chip module shows an IC chip 310, bond wires 312, and A-shaped antenna contact leads 308. The embodiment of the antenna contact leads 308 depicted in FIG. 3 is a possible embodiment of the antenna contact leads 108 depicted in FIG. 1. However, the antenna contact leads 108 depicted in FIG. 1 are not limited to the embodiment shown in FIG. 3. For example, the antenna contact leads 108 depicted in FIG. 1 can be implemented in a shape that is different from the antenna contact leads shown in FIG. 3.

A process of manufacturing the dual-interface IC chip module 150 depicted in FIG. 1 in accordance with an embodiment of the invention is described with reference to FIGS. 4-12. Compared with a conventional manufacturing process in which a dual-interface IC chip module is made using a relatively expensive double-sided contact tape as a base structure, the manufacturing process produces the dual-interface IC chip module 150 using a cost-effective prefabricated single-sided contact base structure, e.g., a single-sided contact tape, and antenna contact leads that are attached to the single-sided contact base structure. By using the prefabricated single-sided contact base structure, the cost of the dual-interface IC chip module is significantly reduced. In addition, the manufacturing process produces the dual-interface IC chip module 150 by applying an adhesive material to only partially cover an overlapping area of the antenna contact 108 and the substrate 104. Consequently, the dual-interface IC chip module 150 can be produced more cost-effectively than a dual-interface contact structure manufactured by applying an adhesive material to completely cover an overlapping area of an antenna contact and a substrate. Further, attaching the antenna contact to the single sided substrate by applying an adhesive material to completely cover an overlapping area of the antenna contact and the single sided substrate can result in stiffness increase of the module substrate and significant amount of adhesive usage. Attaching the antenna contact to the single sided substrate only by partial coverage of adhesive material can enable flexible movement of clip in nonglued areas, reduce contamination of antenna connection area by glue fillet and allow more robust handling, transportation and production.

As illustrated in FIG. 4, the process of manufacturing the dual-interface IC chip module 150 begins by obtaining a single-sided contact tape 440 having multiple single-sided contact base structures 450. In FIG. 4, the single-sided contact tape 440 includes two columns of single-sided contact base structures 450. As shown in FIG. 4, a back-side view of the single-sided contact tape shows the back-side of single-sided contact base structures with bonding holes 426. The single-sided contact tape may be in the form of standalone sheet or in a reel-to-reel format. Although the single-sided contact tape is shown in FIG. 4 as including two columns of single-sided contact base structures, in other embodiment, the single-sided contact tape may include a single column or more than two columns of single-sided contact base structures. In addition, although the single-sided contact base structure 450 is shown in FIG. 4 as including certain number of bonding holes, in other embodiment, the single-sided contact base structure may include bond holes in any suitable number. The single-sided contact tape may be obtained by purchasing it from a tape supplier, such as Linxens, Interplex, Kinsus, LG Innotek and Possehl. Alternatively, the single-sided contact tape may be obtained by making it from scratch using a known manufacturing process.

FIG. 5 is a cross-sectional view (along a dotted line 452 shown in FIG. 4) of the single-sided contact base structure 450 depicted in FIG. 4. In the embodiment of FIG. 5, the single-sided contact base structure 450 includes the contact layer 102 with the groove lines 124-1, 124-2, the adhesive layer 103 and the substrate 104. The bonding hole 426 is present on the substrate to enable future wire bonding.

After obtaining the single-sided contact tape 440, the manufacturing process proceeds to the next step in which adhesive is applied to the single-sided contact tape. FIG. 6 depicts a portion 650 of one of the single-sided contact base structures 450 (at an area 454 shown in FIG. 4) of the single-sided contact tape with applied adhesive 610. In FIG. 6, glue or other adhesive material is applied (e.g., dispensed) to one of the single-sided contact base structure of the single-sided contact tape. The adhesive may be conductive such that the antenna contact leads 108 are in electrical contact with the substrate 104. As shown in FIG. 6, the adhesive is applied to the single-sided contact tape at two adhesive application areas 660-1, 660-2. The adhesive application areas are selected such that the dual-interface IC chip module 150 can deform to avoid the damages of the IC card under mechanical stress. In some embodiments, the adhesive application areas 660-1, 660-2 are defined to be the same as or larger than the area of the antenna contact leads 108 that are covered by the encapsulation 114. Compared to applying the adhesive freely to encircle bond holes 426, applying the adhesive only at the selected adhesive application areas reduces the amount of glue or other adhesive material usage, increases mechanical flexibility of the dual-interface IC chip module 150 and eases the restriction to adhesive material selection on needed flexibility. In some embodiments, one or more temporary adhesive application areas are used to provide a break joint option for more robust handling, transportation and production of the dual-interface IC chip module 150. For example, as shown in FIG. 6, the adhesive can be applied to the temporary adhesive application area 660-3 to form a break joint between the antenna contact leads 108 and the substrate 104. The break joint can be removed in a final IC card manufacturing process.

FIG. 7 is a cross-sectional view (along a dotted line 652 shown in FIG. 6) of the single-sided contact tape 440, which includes the single-sided contact tape portion 650 depicted in FIG. 6. In FIG. 7, the single-sided contact tape includes the contact layer 102 with the groove lines 124-1, 124-2, the adhesive layer 103, the substrate 104, and the adhesive layer 106, which is formed from the applied adhesive 610.

After the adhesive 610 has been applied to the single-sided contact tape 440, the manufacturing process proceeds to the next step in which antenna contact leads are attached to the single-sided contact tape using the applied adhesive to form a dual-interface contact tape with multiple dual-interface contact structures. The antenna contact leads can be attached to the single-sided contact tape by a pick-and-place process in which one or more antenna contact leads are picked up and placed on the single-sided contact tape. Alternatively, the antenna contact leads can be attached to the single-sided contact tape in a reel-to-reel process in which adhesive is applied to the antenna contact leads on a first reel, which is then applied onto a second reel, i.e., the single-sided contact tape, similar to the process of attaching a sheet of paper labels onto products.

FIG. 8 depicts a portion 850 of the dual-interface contact tape with an attached antenna contact lead 808, which is part of a single dual-interface contact structure. The dual-interface contact tape portion 850 corresponds to part of the single-sided contact tape portion 650 of FIG. 6. In FIG. 8, the antenna contact lead 808 is attached to the single-sided contact tape 440 via the applied adhesive 610 (shown in FIGS. 6 and 7). Alternatively, the antenna contact lead can be attached to the single-sided contact tape by applying an adhesive to the antenna contact lead and then placing antenna contact lead with the adhesive on the single-sided contact tape. The antenna contact lead can be attached to the single-sided contact tape only on inner lead-fingers of the antenna contact lead. Alternatively, the antenna contact lead can be attached to the single-sided contact tape on inner lead-fingers of the antenna contact lead and on at least one position to form a break joint. The antenna contact lead 808 depicted in FIG. 8 is one possible embodiment of the antenna contact leads 108 depicted in FIG. 1. However, the antenna contact leads 108 depicted in FIG. 1 are not limited to the embodiment shown in FIG. 8.

FIG. 9 is a cross-sectional view (along a dotted line 852 shown in FIG. 6) of the dual-interface contact tape, which includes the dual-interface contact structure portion 850 depicted in FIG. 8. In particular, FIG. 9 shows a single dual-interface contact structure formed within the dual-interface contact tape. As shown in FIG. 9, the dual-interface contact structure includes the contact layer 102 with the groove lines 124-1, 124-2, the adhesive layer 103, the substrate 104, the adhesive layer 106, and two antenna contact leads 808. In an embodiment, the antenna contact leads 808 shown in FIGS. 8 and 9 are produced from a sheet or a reel to reel of a conductive material or a sheet or a reel to reel of a non-conductive material with a conductive plating. A curing step (e.g., oven curing) may be performed by applying heat to the dual-interface contact structure. Since the dual-interface contact structure of FIG. 9 is made from an inexpensive single-sided contact tape, the cost of the dual-interface contact structure is significantly lower than a comparable conventional dual-interface contact structure made from an expensive double-sided contact tape. In addition, because the mechanical flexibility of the dual-interface contact structure portion 850 is obtained by the gap between the adhesive layer 106 and the antenna contact lead 808, the adhesive 610 needs not be made of a flexible material, which is typically more expensive. Consequently, the dual-interface contact structure of FIG. 9 can be made more cost-effectively, compared to a dual-interface contact structure made by conventional manufacturing processes.

After the antenna contact leads 808 have been attached to the single-sided contact tape 440 to form the dual-interface contact tape, the manufacturing process proceeds to the next step in which IC chips, bond wires and encapsulations are added to the dual-interface contact structures in the dual-interface contact tape to form dual-interface IC chip modules in the dual-interface contact tape. FIG. 10 depicts an embodiment of a dual-interface contact tape 1040 having multiple dual-interface IC chip modules 1050, which are formed by attaching the IC chips 110 to dual-interface contact structures 850, attaching the bond wires 112 to the antenna contact leads 808 and to the contact layer 102 (not shown in FIG. 10), and then forming the encapsulations 114 over the IC chips and the bond wires. A separation (e.g., punching or cutting) step can then be performed to separate (e.g., punch out or cut) the dual-interface contact tape 1040 to separate the dual-interface IC chip modules 1050 into individual pieces. For example, a punching process can be performed based on the outline shown in FIG. 4 to separate the dual-interface IC chip modules into individual pieces after a hotmelt tape is applied to the backside of the tape 440. The dual-interface IC chip module 1050 depicted in FIG. 10 is one possible embodiment of the dual-interface IC chip module 150 depicted in FIG. 1. However, the dual-interface IC chip module 150 depicted in FIG. 1 is not limited to the embodiment shown in FIG. 10.

FIG. 11 is a cross-sectional view (along a dotted line 1052 shown in FIG. 10) of one of the dual-interface IC chip modules 1050 depicted in FIG. 10. As shown in FIG. 11, the dual-interface IC chip module includes the contact layer 102 with the groove lines 124-1, 124-2, the adhesive layer 103, the substrate 104, the adhesive layer 106, the two antenna contact leads 808, the IC chip 110, the bond wires 112, and the encapsulation 114. In the embodiment depicted in FIG. 11, the adhesive layer is only applied to the area of the substrate that is covered by the encapsulation, as indicated by dotted line 1160. Outside the encapsulation, no adhesive coverage is applied to enable flexibility of the antenna contact lead. Compared to dual-interface IC chip modules made by attaching antennal contact leads to the substrate through applying adhesive material to cover the overlapping area between the antenna contact leads and the substrate, the dual-interface IC chip modules 1050 depicted in FIG. 10 has a reduced amount of glue or other adhesive material usage, increased mechanical flexibility and a wide range of adhesive material selection. FIG. 12 illustrates some mechanical tests for the dual-interface IC card 100 depicted in FIG. 1. As shown in illustrated in FIG. 12, the dual-interface IC card is bent in different degrees and angles in mechanical tests of the dual-interface IC card. When the dual-interface IC card 100 is bent, the dual-interface IC chip module 1050 deforms, following the card body curvature. FIG. 13 illustrates a deformation of the dual-interface IC card 100 depicted in FIG. 1 under mechanical tests. As illustrated in FIG. 13, when the dual-interface IC card is bent, the antenna contact lead 108 is shifted from its original location to a new location 1080, as shown in the dotted circle 1190.

FIG. 14 is a process flow diagram of a method for manufacturing a dual-interface IC card component in accordance with an embodiment of the invention. At block 1402, a single-sided contact base structure is obtained, where the single-sided contact base structure includes a substrate with an electrical contact layer. In some embodiments, the single-sided contact base structure is part of a single-sided contact tape, such as the single-sided contact tape 440 shown in FIGS. 4 and 5. At block 1404, at least one antenna contact lead is attached to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card. In some embodiments, the dual-interface contact structure is part of a dual-interface contact tape, such as the dual-interface contact tape shown in FIGS. 8 and 9.

Turning back to FIG. 1, in some embodiments, the antenna contact leads 108 are placed on the substrate 104, and subsequently, the contact layer 102 is formed on the substrate. In a manufacturing process in accordance with an embodiment of the invention, in a first step, holes or other openings are punched into the substrate, which may be a glass epoxy tape or other isolation layer. In a second step, adhesive (e.g., the adhesive 610 at FIG. 6) is applied onto the antenna contact leads or on the substrate. In a third step, the antenna contact leads are placed on the substrate. In a fourth step, the adhesive is cured. In a fifth step, a conductive tape is attached (e.g., laminated) to the substrate to form the contact layer 102. It is also possible to cure the adhesive together with the conductive tape. In a sixth step, the structure formed by the substrate and the conductive tape is separated (e.g., with laser or by etching) into different areas, which can be used for the necessary ISO (e.g., ISO/IEC 14443) areas for interconnection. In a seventh step, the contact layer and the antenna contact leads are plated simultaneously or one side after the other with one or more plating materials, such as nickel (Ni), gold (Au) and palladium (Pd). Plating the contact layer and the antenna contact leads allows the contact layer and the antenna contact leads to have better appearance and/or better electrical conductivity. For example, the antenna contact leads may be non-conductive and plating the antenna contact leads allows surfaces of the antenna contact leads to be conductive.

FIG. 15 is a process flow diagram of a method for manufacturing a dual-interface IC card component in accordance with an embodiment of the invention. At block 1502, a base structure that includes a substrate is obtained. At block 1504, at least one antenna contact lead is attached to the base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card. At block 1506, the at least one antenna contact and the base structure are plated with at least one metal material.

Although the operations of the method herein are shown and described in a particular order, the order of the operations of the method may be altered so that certain operations may be performed in an inverse order or so that certain operations may be performed, at least in part, concurrently with other operations. In another embodiment, instructions or sub-operations of distinct operations may be implemented in an intermittent and/or alternating manner.

In addition, although specific embodiments of the invention that have been described or depicted include several components described or depicted herein, other embodiments of the invention may include fewer or more components to implement less or more feature.

Furthermore, although specific embodiments of the invention have been described and depicted, the invention is not to be limited to the specific forms or arrangements of parts so described and depicted. The scope of the invention is to be defined by the claims appended hereto and their equivalents. 

What is claimed is:
 1. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising: obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card.
 2. The method of claim 1, further comprising attaching an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises only applying the adhesive material to an area of the substrate that is covered by the encapsulation.
 3. The method of claim 1, further comprising attaching an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises applying the adhesive material to an area of the substrate that is covered by the encapsulation and another area that is not covered by the encapsulation to form a break joint between the at least one antenna contact lead and the substrate.
 4. The method of claim 1, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises: picking up an antenna contact lead; and placing the antenna contact lead on the single-sided contact base structure to attach the antenna contact lead to the single-sided contact base structure.
 5. The method of claim 1, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises: applying the adhesive material to the substrate of the single-sided contact base structure; and placing an antenna contact lead on the applied adhesive material to attach the antenna contact lead to the single-sided contact base structure.
 6. The method of claim 5, wherein applying the adhesive material to the substrate comprises dispensing glue onto the substrate.
 7. The method of claim 5, further comprising curing the adhesive material.
 8. The method of claim 7, further plating the at least one antenna contact lead after curing the adhesive material.
 9. The method of claim 1, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises: applying the adhesive material to an antenna contact lead; and placing the antenna contact lead with the applied adhesive material on the single-sided contact base structure to attach the antenna contact lead to the single-sided contact base structure.
 10. The method of claim 1, wherein the contact layer is attached to a first side of the substrate, and wherein the at least one antenna contact lead is attached to a second, opposite, side of the substrate.
 11. The method of claim 1, further comprising obtaining the at least one antenna contact lead by punching, etching or laser cutting a sheet or a reel to reel of a conductive material or a sheet or a reel to reel of a non-conductive material with a conductive plating.
 12. The method of claim 1, wherein obtaining the single-sided contact base structure comprises obtaining a single-sided contact tape.
 13. The method of claim 1, further comprising electrically connecting the at least one antenna contact lead to an antenna located on the substrate through a bond wire or other electrical connection.
 14. The method of claim 1, further comprising attaching an IC chip, at least one bond wire or other electrical connection and an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module.
 15. The method of claim 1, wherein after the at least one antenna contact lead is attached to the single-sided contact base structure, the at least one antenna contact lead can move in a portion of the overlapping area that is not covered by the adhesive material while maintaining an electrical connection to an antenna of the dual-interface IC card.
 16. The method of claim 1, wherein the adhesive material comprises one of conductive glue, non-conductive glue, a double sided sticky tape and an anisotropic conductive foil.
 17. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising: obtaining a base structure, wherein the base structure comprises a substrate; attaching at least one antenna contact lead to the base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card; and plating the at least one antenna contact and the base structure with at least one metal material.
 18. The method of claim 17, further comprising attaching an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module, wherein attaching the at least one antenna contact lead to the base structure comprises only applying the adhesive material to an area of the substrate that is covered by the encapsulation.
 19. The method of claim 17, wherein the metal material comprises one of nickel (Ni), gold (Au) or palladium (pd).
 20. A dual-interface integrated circuit (IC) card component, the dual-interface IC card component comprising: a substrate; an electrical contact layer attached to a first side of the substrate, the electrical contact layer comprising a contact plate and a plurality of grooves; and at least one antenna contact lead glued to a second, opposite, side of the substrate in an area that is smaller than the overlapping area of the at least one antenna contact and the substrate. 